Chemical vapor resistant epoxy composition

ABSTRACT

A two part, curable, epoxy composition useful for potting or sealing electrical devices for use in hazardous locations. Cured reaction products of the epoxy composition meet most or all UL 674 requirements and are useful to seal apertures in electrical equipment. Equipment sealed with the disclosed compositions can meet the UL 674 requirement.

This application claims the benefit of U.S. patent application Ser. No.14/967,999 filed Dec. 14, 2015 which is a divisional of U.S. patentapplication Ser. No. 13/713,164 filed Dec. 13, 2012 which is acontinuation of International PCT Patent Application No.PCT/US2011/052121 filed Sep. 19, 2011 and published on Mar. 29, 2012 asWO 2012/040094, which claims the benefit of U.S. Provisional PatentApplication No. 61/385,692 filed Sep. 23, 2010, the contents of each ofwhich are incorporated herein by reference in their entirety.

FIELD

The present disclosure relates generally to a two part, curable, epoxycomposition useful for potting or sealing electrical devices for use inhazardous locations.

BACKGROUND

Some applications require the use of electrical equipment in hazardouslocations where exposure to chemical, flammable and/or combustibleconditions is likely. Electrical equipment used in such hazardouslocations requires construction to, and compliance with, exactingstandards to lessen the chance of electrical equipment malfunction andfailure.

Underwriters Laboratories Inc. (UL) is an independent product safetycertification organization that has been testing products and writingsafety standards for over a century. Underwriters Laboratories, Inc haswritten safety standard UL 674 “Standard for Electric Motors andGenerators for Use in Division 1 Hazardous (Classified) Locations”.Electrical equipment such as motors, generators, panels, raceways andjunctions used under hazardous conditions can be constructed inaccordance to the UL 674 standard. Equipment used in such conditionstypically must be approved under this standard. Approval under a ULstandard can require testing of the system and/or system components toensure compliance with that UL standard.

One part of the UL 674 standard requires that openings in electricalequipment be potted or sealed with an approved material that can meetspecific performance criteria for resistance to chemicals. Thesecriteria are specified in UL standard 674, section 45. UL standard 1203,“Tests On Sealing Materials”, is similar to UL 674, section 45. Thisstandard specifies resistance to damage and degradation of a sealantmaterial after exposure to vapors from a number of specified chemicals.Approved sealant materials must retain at least 85% of their compressivestrength after 168 hours exposure to saturated vapors in air of each ofthe specified chemicals and must not shrink, swell, crack or lose orgain more than 1 percent of their weight.

Most epoxy compositions will degrade substantially when exposed to oneor more of the test chemical vapors and therefore can not meet thechemical resistance requirements of UL 674. Retention of at least 85%compression strength after exposure to glacial acetic acid is especiallydifficult for most epoxy compositions.

There are very few materials alleged to be approved for use under the UL674 standard. One material is CHICO available from Crouse Hinds Cooper.CHICO is an inorganic cementitious material that is mixed with water andpoured into a fitting or aperture to form a seal. More recently, CHICOSPEEDSEAL available from Crouse Hinds Cooper has been approved. CHICOSPEEDSEAL is believed to be polyurethane that expands during curing toform a seal in a fitting or aperture. Other useful sealants areKNEADASEAL and KNEADASEAL SL available from Polymeric Systems, Inc. ofPennsylvania, USA. KNEADASEAL is a solid epoxy putty stick that iskneaded between a user's fingers to mix and subsequently forced into afitting or aperture to form a seal that subsequently cures. Forcing thedense, solid putty into a small aperture to form a seal is difficult,especially if wires penetrate the aperture. KNEADASEAL SL is a pourableepoxy compound. Technical literature notes that KNEADASEAL SL containsbisphenol A epoxy resins.

SUMMARY

Briefly, one aspect of the disclosure provides a two part epoxycomposition comprising an epoxy resin component and a curing agentcomponent. The epoxy resin component advantageously comprises a novolacresin, a diglycidyl ether of bisphenol F resin or a combination thereof.The curing agent component advantageously comprises an amine, an aminefunctional adduct of an amine and an epoxy resin, or a combinationthereof. In an advantageous variation the curing agent componentcomprises an aliphatic or cycloaliphatic amine, an amine functionaladduct of ethylene diamine and an epoxy resin, or a combination thereof.The epoxy composition can optionally include one or more compositionadditives in the epoxy resin component or the curing agent component.

In one embodiment the epoxy resin component consists essentially of anovolac resin, a diglycidyl ether of bisphenol F resin or a combinationthereof. As used herein an epoxy component that consists essentially ofa novolac resin, a diglycidyl ether of bisphenol F resin or acombination thereof does not include epoxy resins other than a novolacresin or a diglycidyl ether of bisphenol F resin but may include othernon-epoxy resin components.

In one embodiment the curing agent component consists essentially of analiphatic or cycloaliphatic amine, an amine functional adduct ofbisphenol F, or a combination thereof. As used herein a curing agentcomponent consists essentially of an aliphatic or cycloaliphatic amine,an amine functional adduct of bisphenol F or a combination thereof doesnot include curatives other than curing agent component consistsessentially of an aliphatic or cycloaliphatic amine, an amine functionaladduct of ethylene diamine and an epoxy resin, or a combination thereofbut may include other non-epoxy curative components.

The two components are stored separately and mixed in predefinedproportions to form a mixed epoxy composition shortly before use. Curingof the mixed composition starts when the components are mixed andproceeds at room temperature.

The mixed epoxy composition can be disposed within an electrical housingaperture and will flow around projections in the aperture. Curedreaction products of the epoxy composition meet most or all UL 674requirements and are useful to seal apertures in electrical equipment.Equipment sealed with the disclosed compositions can meet the UL 674requirement.

The disclosed compounds include any and all isomers and stereoisomers.In general, unless otherwise explicitly stated the disclosed materialsand processes may be alternately formulated to comprise, consist of, orconsist essentially of, any appropriate components, moieties or stepsherein disclosed. The disclosed materials and processes mayadditionally, or alternatively, be formulated so as to be devoid, orsubstantially free, of any components, materials, ingredients,adjuvants, moieties, species and steps used in the prior artcompositions or that are otherwise not necessary to the achievement ofthe function and/or objective of the present disclosure.

When the word “about” is used herein it is meant that the amount orcondition it modifies can vary some beyond the stated amount so long asthe function and/or objective of the disclosure are realized. Theskilled artisan understands that there is seldom time to fully explorethe extent of any area and expects that the disclosed result mightextend, at least somewhat, beyond one or more of the disclosed limits.Later, having the benefit of this disclosure and understanding theconcept and embodiments disclosed herein, a person of ordinary skillcan, without inventive effort, explore beyond the disclosed limits and,when embodiments are found to be without any unexpected characteristics,those embodiments are within the meaning of the term about as usedherein.

DETAILED DESCRIPTION

The disclosed epoxy composition is a two part composition comprising anepoxy resin component and a separate curing agent component. As usedherein a two part composition has two components that are kept separateuntil use. Shortly before use the two components are homogeneouslymixed. The mixture can gel, increasing in viscosity and stiffness, atabout room temperature and in a short time, for example about 20 minutesto about 240 minutes. During this time the mixture will increase inviscosity and stiffness to a point at which it is not convenient or evenpossible to use. This time is also referred to as working life. Themixture can subsequently cure, for example, in about 24 hours to about240 hours to provide substantial physical properties. Because the twopart epoxy composition begins to gel and cure at room temperature uponmixing of the resin component and the curing agent component, themixture will have substantially no storage life beyond the cure time.Room temperature typically falls within the range of about 20° C. (68°F.) to about 25° C. (77° F.). The two part epoxy composition does notinclude a latent hardener as the main curing component. The two partepoxy composition does not require heat to initiate a cure reaction,although heat can be optionally used to accelerate an existing curereaction or to “push” an existing cure reaction toward completion. Thetwo part epoxy composition is distinguished from, and does notencompass, a single part epoxy composition comprising a storable mixtureof epoxy resin and latent hardener. The single part epoxy composition isstable, e.g. does not gel or cure, at about room temperature for longperiods of time and requires elevated temperatures to activate thelatent curing agent and thereby initiate a reaction between the resinpart and the hardener. The latent hardener of a single part compositioncan not initiate a reaction useful to cure the single part compositionat about room temperature in a short time to provide substantialphysical properties. One or both of the epoxy resin component and thecuring agent component comprise one or more additives.

Cured reaction products of the disclosed epoxy composition can meet mostor all of the chemical resistance and other requirements for sealingcompounds set out in UL 674 section 45 and are useful as sealants andpotting compounds for electrical equipment used under this standard. ULstandard 674 and UL standard 1203 are each incorporated by referenceherein in their entirety.

Typically, the epoxy composition, e.g. the mixture of epoxy resincomponent and curing agent component, comprises about 80 weight percentto about 100 weight percent of epoxy resin component.

Epoxy Resin Component

Epoxy resins are characterized by one or more of their precursors,structure, oxirane oxygen content and epoxy equivalent weight. The epoxyequivalent weight is the weight of resin required to obtain oneequivalent of epoxy functional group. The epoxy resins can be semisolidepoxy resins, solid epoxy resins, liquid epoxy resins and mixtures ofthe above resins.

In general, a large number of polyepoxides having at least about twoepoxy groups per molecule are available. The polyepoxides may besaturated, unsaturated, cyclic or acyclic, aliphatic, alicyclic,aromatic or heterocyclic polyepoxide compounds. Examples of polyepoxidesinclude the polyglycidyl ethers, which are prepared by reaction ofepichlorohydrin or epibromohydrin with a polyphenol in the presence ofalkali. Other exemplary polyphenols are, for example, resorcinol,pyrocatechol, hydroquinone, bisphenol A(bis(4-hydroxyphenyl)-2,2-propane), bisphenol F(bis(4-hydroxyphenyl)methane), bis(4-hydroxyphenyl)-1,1-isobutane,4,4′-dihydroxybenzophenone, bis(4-hydroxyphenyl)-1,1-ethane, and1,5-hydroxynaphthalene. Other polyphenols used as the basis for thepolyglycidyl ethers are the known condensation products of phenol andformaldehyde or acetaldehyde of the novolac resin-type.

Other polyepoxides include the polyglycidyl ethers of polyalcohols ordiamines. Such polyglycidyl ethers are derived from polyalcohols, suchas ethylene glycol, diethylene glycol, triethylene glycol, 1,2-propyleneglycol, 1,4-butylene glycol, triethylene glycol, 1,5-pentanediol,1,6-hexanediol or trimethylolpropane.

Other polyepoxides include polyglycidyl esters of polycarboxylic acids,for example, reaction products of glycidol or epichlorohydrin withaliphatic or aromatic polycarboxylic acids, such as oxalic acid,succinic acid, glutaric acid, terephthalic acid or a dimeric fatty acid.Other epoxides are derived from the epoxidation products ofolefinically-unsaturated cycloaliphatic compounds or from natural oilsand fats.

Polyglycidyl ether of bisphenol F resins and novolac resins arepresently believed advantageous for use in this application as curedreaction products of these resins appear more chemically resistant thanother epoxy resin types such as polyglycidyl ethers of bisphenol A.

In one embodiment the epoxy component comprises one or more novolacepoxy resins, one or more difunctional bisphenol F epoxy resins or amixture of one or more novolac epoxy resins and one or more difunctionalbisphenol F epoxy resins. D.E.N. 431 available from Dow Chemical Companyand EPON 154 available from Hexion Specialty Chemicals are examples ofnovolac epoxy resins. EPON 863 available from Hexion Specialty Chemicalsis an example of a difunctional bisphenol F epoxy resin.

In one embodiment the epoxy component comprises a combination of about40% to about 99% by weight of epoxy component of one or more novolacepoxy resins and about 1% to about 60% by weight of epoxy component ofone or more polyglycidyl bisphenol F epoxy resins.

In one embodiment the epoxy resin component consists essentially of anovolac resin, a diglycidyl ether of bisphenol F resin or a combinationthereof. As used herein an epoxy component that consists essentially ofa novolac resin, a difunctional bisphenol F resin or a combinationthereof does not include epoxy resins other than a novolac resin or adifunctional bisphenol F resin but may include other non-epoxy resincomponents such as composition additives.

In one embodiment the epoxy component consists essentially of acombination of about 40% to about 99% by weight of epoxy component ofone or more novolac epoxy resins and about 1% to about 60% by weight ofepoxy component of one or more difunctional bisphenol F epoxy resins.

Curing Agent Component

The curing agent can comprise hardener compounds that initiate a curereaction with the epoxy resin component at about room temperature. Thehardener compound may function in a catalytic manner or, in advantageousembodiments, participate directly in the curing process by reaction withthe epoxy resin component. Hardener compounds useful to cure the epoxyresin component at about room temperature include one or more ofaliphatic amines (including linear aliphatic, branched aliphatic andcycloaliphatic amines), polyetheramines, polyamides, amidoamines,aromatic amines, and/or mixtures thereof. Polyamides are condensationproducts of polymerized fatty acids with polyalkyl polyamines preparedaccording to procedures well know in the art. Specific curing agentsutilized will depend on the specific epoxy resin utilized in the epoxyresin component, cured product properties desired and to a lesser extenton the rate and degree of curing desired for the epoxy composition.

The curing agent component can include an aminopolyalkyeneaminecomponent. Some useful aminopolyalkyeneamine components include, forexample, ethylenediamine, diethylenetriamine, triethylenetetramine,tetraethylenepentamine, and polymers, oligomers, analogs, such aspolyamides like the Versamid series (Cognis Co), and amidoamines likethe Ancamide series (Air Products), and derivatives thereof, sold bymany manufacturers, and well-known to those skilled in the art.Aliphatic and cycloaliphatic amines like the Ancamine series (AirProducts) can advantageously be used in the curing agent component.

In principle, catalytically active tertiary acryl- or alkyl-amines, suchas benzyldimethylamine, tris(dimethylamino)phenol, piperidine orpiperidine derivatives, may also be useful. Various imidazolederivatives may also be useful as catalytically-active accelerators.Examples which may be mentioned are 2-ethyl-2-methylimidazole,N-butylimidazole, benzimidazole and N-C₁ to C₁₂-alkylimidazoles orN-arylimidazoles.

In one advantageous variation the curing agent component comprises analiphatic or cycloaliphatic amine, an amine functional adduct ofethylene diamine and an epoxy resin, or a combination thereof.

In one advantageous embodiment the curing agent component comprises acombination of about 15% to about 85% by weight of curing agentcomponent of an aliphatic amine and about 10% to about 60% by weight ofcuring agent component of amine functional adduct of ethylene diamineand an epoxy resin. ANCAMINE 2422 available from Air Products is anexample of a cycloaliphatic amine and ANCAMINE 2410 is an example of anamine functional adduct of ethylene diamine and a bisphenol A epoxyresin. It is believed that a curing agent component comprising an aminefunctional adduct of a bisphenol F epoxy resin, when mixed with theepoxy resin component, would provide cured reaction products of thatmixture with improved chemical resistance and better maintaincompressive strength, dimensional stability and weight stability.

In one embodiment the curing agent component consists essentially of acombination of aliphatic amine and an amine functional adduct of anamine and an epoxy resin. As used herein a curing agent componentconsisting essentially of a combination of aliphatic amine and an aminefunctional adduct of an amine and an epoxy resin excludes curing agentcomponents having curing agents that are not aliphatic amine and anamine functional adduct of an amine and an epoxy resin.

The amount of curing agent component utilized in the curable compositionwill depend upon a number of factors, including whether the hardenercompound acts as a catalyst or participates directly in crosslinking ofthe composition, the concentration of epoxy groups and other reactivegroups in the composition, the desired curing rate, temperature and soforth. Typically, the epoxy composition comprises about 1 to 40 weightpercent of curing agent component.

It may be convenient to use a specific volumetric ratio of epoxy resincomponent to curing agent component, for example 1:1, 2:1, 3:1 or 4:1ratios of epoxy resin component to curing agent component. Someapplications are sensitive to heat and require sealants having a lowermaximum cure temperature, for example about 150° C. and advantageouslyabout 125° C. and desirably about 100° C. The use of relatively equalratios, for example 1 or 2 parts epoxy resin component to 1 part curingagent component, is desirable for lessening heat evolved by the mixedcomposition during the cure reaction and thereby lessening the maximumcure temperature.

Composition Additives

The curable composition can optionally include one or more compositionadditives. As used herein a composition additive is a material that isformulated into either or both of the epoxy resin component or thecuring agent component and remains present during use of the volumetricratio of epoxy resin to curing agent. Composition additives include, forexample, one or more of types of cure accelerators, particulate impactmodifiers, auxiliary impact modifiers, auxiliary toughening agents,diluents, adhesion promoters, fillers, thixotropes, other adjuvants; orcombinations thereof to provide the epoxy resin component, the curingagent component and/or the mixed epoxy composition with desirablephysical and chemical properties and to provide cured reaction productsof the epoxy composition with desirable physical and chemicalproperties. Naturally, the composition additives should not adverselyimpact chemical resistance or other properties of the cured reactionproducts allowing their use in this application.

Cure Accelerator

Cure accelerators are materials that materially shorten the gel timeand/or increase completion of cure. Various compounds, such as tertiaryamines, imides, polyamines, cyclicamines and arylamines also can beincluded in the epoxy composition as cure accelerators. Also included aspotential accelerators, but not limited to these, are the followingclasses: strong acids, organic and inorganic acids, fluoro acids,fluoro-sulphonic acids, fluoro acetic acids, water, alcohols, phenols,fluoro-phenols, salicylic acid, amine, calcium, and metal salts of anyor all the acids above, polyols, active hydrogen materials and theirsalts and/or complexes and the like. In one embodiment the epoxycomposition comprises one or more cure accelerators, for examplefurfuryl alcohol or benzyl alcohol.

The useful amounts of accelerator typically range from about 0% byweight to about 30% by weight of the total composition. Desirably, anaccelerator is present in an amount from about 1% by weight to about 10%by weight of the total composition.

Core-Shell Particulate Impact Modifier

Toughness of reaction products of the cured epoxy composition can beimproved or modified by the incorporation of one or more types ofparticles having a core-shell structure, e.g. a particle having a corecomprised of a first material surrounded by a shell comprised of asecond material, wherein the first and second materials are typicallydifferent. The core-shell particle can have a core comprised of apolymeric material having elastomeric or rubbery properties (i.e., aglass transition temperature less than about 0° C., e.g., advantageouslyless than about −30° C.) surrounded by a shell comprised of anon-elastomeric polymeric material (i.e., a thermoplastic orthermoset/crosslinked polymer having a glass transition temperaturegreater than ambient temperatures, e.g., greater than about 50° C.).

The core can be formed predominantly from feed stocks of polybutadiene,polyacrylate, polystyrene, polybutadiene/styrene mixture,polybutadiene/acrylonitrile mixture, polyols and/or polysiloxanes or anyother monomers that give a lower glass transition temperature. Forexample, the core can be comprised of a diene homopolymer or copolymer(for example, a homopolymer of butadiene or isoprene; a copolymer ofbutadiene or isoprene with one or more ethylenically unsaturatedmonomers such as vinyl aromatic monomers, (meth)acrylonitrile,(meth)acrylates, or the like) or an acrylate or methacrylate polymer.Other rubbery polymers may also be suitably be used for the core,including polybutylacrylate elastomer or polysiloxane elastomer (e.g.,polydimethylsiloxane, particularly crosslinked polydimethylsiloxane).

The shell can be formed predominantly from feed stocks ofpolymethylmethacrylate, polystyrene or polyvinyl chloride or any othermonomers that give a higher glass transition temperature. For example,the shell can be comprised of a polymer or copolymer of one or moremonomers such as an acrylate, (meth)acrylate (e.g., methylmethacrylate), vinyl aromatic monomer (e.g., styrene), vinyl cyanide(e.g., acrylonitrile), unsaturated acids and anhydrides (e.g., acrylicacid), (meth)acrylamide, and the like having a suitably high glasstransition temperature.

The core-shell particle may be comprised of more than two layers (e.g.,a central core of one material may be surrounded by a second core of adifferent material or the core may be surrounded by two shells ofdifferent composition or the particle may have a soft core, hard shell,soft shell, hard shell structure. The particles can comprise a core andat least two concentric shells having different chemical compositionsand/or properties. Either the core or the shell or both the core and theshell may be crosslinked (e.g., ionically or covalently). The shell maybe grafted onto the core. The polymer comprising the shell may bear oneor more different types of functional groups (e.g., epoxy groups) thatare capable of interacting with other components of the compositions ofthe present invention.

Some of the core-shell particles structures available from Rohm and Haasare believed to have a core made from cross linkedpoly(butadiene/styrene) and a polymethylmethacrylate shell. Some of thecore-shell particles structures available from Nippon Zeon are believedto have a core comprising an acrylate or methacrylate polymer having aglass transition of about −30° C. or lower and a shell comprising anacrylate polymer or a methacrylate polymer having a glass transitiontemperature of about 70° C. or higher.

The outer surface of the core-shell particle may be modified by reactionwith a coupling agent, oxidizing agent or the like so as to enhance theability to disperse the particle in the component (e.g., reduceagglomeration of the particles, reduce the tendency of the particles tosettle out of the epoxy resin). Modification of the particle surface mayalso enhance the adhesion of the epoxy resin matrix to the particle whenthe adhesive is cured. The particle may alternatively be irradiated soas to change the extent of crosslinking of the polymer(s) constitutingthe particle in different regions of the particle. For example, theparticle may be treated with gamma radiation such that the particlematerial is more highly crosslinked near the surface of the particlethan in the center of the particle.

Particles treated with a reactive gas or other reagent to modify theouter surfaces of the particles by, for instance, creating polar groups(e.g., hydroxyl groups, carboxylic acid groups) on the particle surface,are also suitable for use in the present invention. Illustrativereactive gases include, for example, ozone, Cl₂, F₂, O₂, SO₃, andoxidative gases. Methods of surface modifying rubber particles usingsuch reagents are known in the art and are described, for example, inU.S. Pat. Nos. 5,382,635; 5,506,283; 5,693,714; and 5,969,053, each ofwhich is incorporated herein by reference in its entirety. Suitablesurface modified rubber particles are also available from commercialsources, such as the rubbers sold under the tradename VISTAMER byExousia Corporation.

Typically, the core will comprise from about 50 to about 95 percent byweight of the particle while the shell will comprise from about 5 toabout 50 percent by weight of the particle.

The particles are relatively small in size. For example, the averageparticle size may be from about 30 nm to about 10,000 nm, advantageouslyfrom about 50 nm to about 5,000 nm. In certain embodiments the rubberparticles have an average diameter of less than about 500 nm. Forexample, the core-shell particles may have an average diameter withinthe range of from about 25 nm to about 400 nm.

The core shell particles may be dispersed in a matrix, for example aliquid epoxy matrix. Examples of epoxy matrices include the diglycidylethers of bisphenol A, F or S, or biphenol, novolac epoxies,cycloaliphatic epoxies and phenolic resins such as bisphenol-A basedphenoxies. Use of polyglycidyl ether of bisphenol F resins and novolacresins in the epoxy composition are presently believed advantageous.

The core shell particles dispersed in a matrix may be prepared as amasterbatch. For example, the particles are prepared as aqueousdispersions or emulsions. Such dispersions or emulsions may be combinedwith the desired liquid epoxy resin or mixture of liquid epoxy resinsand the water and other volatile substances removed by distillation orthe like to provide the masterbatch. Dispersions of particles having acore-shell structure in an epoxy resin matrix are available from KanekaCorporation under the trade name KANE ACE MX.

Where the particles are initially provided in dry form, it may beadvantageous to ensure that such particles are well dispersed in eitheror both of the epoxy resin component or the curing agent component. Thatis, agglomerates of core-shell particles are preferably broken up so asto provide discrete individual particles, which may be accomplished byintimate and thorough mixing of the dry particles with some or all ofthe other components. For example, dry particles may be blended withliquid epoxy resin for a length of time effective to essentiallycompletely disperse the core-shell particles therein and break up anyparticle agglomerations.

The core shell particles may be present in the epoxy composition in anamount in the range of about 1% to about 50% by weight of the epoxycomposition, advantageously about 2% to about 40% by weight of the epoxycomposition and desirably about 10% to about 30% by weight of the epoxycomposition. The lower limit will be based on the increase in toughnessdesired. At the higher ranges of core shell particle content, viscosityincreases may be observed in the particle comprising component inrelatively short periods of time. Use of higher amounts of core-shellparticles will increase cost of the epoxy composition and may lowerstrength of the epoxy composition cured reaction products withoutproviding a corresponding increase in toughness. The core shellparticles can be formulated into either or both of the epoxy resincomponent or the curing agent component as desirable.

Auxiliary Impact Modifiers/Toughening Agents

The impact properties of epoxy composition cured reaction products canbe improved or modified by the incorporation of one or more auxiliaryimpact modifiers and/or toughening agents. Suitable auxiliary impactmodifier/toughening agents are generally polymeric or oligomeric incharacter, have glass transition (Tg) temperatures below 20° C.(advantageously below 0° C., more advantageously below −30° C. or below−50° C.), and may have one or more functional groups capable ofparticipating in the cure reaction of the epoxy resin component.Suitable reactive functional groups include epoxy groups, hydroxylgroups, carboxylic acid groups and the like.

One type of auxiliary impact modifiers and/or toughening agent comprisesthe epoxy-based prepolymers (sometimes described as “adducts”) obtainedby reacting one or more epoxy resins with one or more amine-terminatedpolymers.

The epoxy resins useful for preparing epoxy based prepolymers may beselected from among the epoxy resins described hereinabove, withparticular preference being given to the diglycidyl ethers ofpolyphenols such as bisphenol F. Liquid epoxy resins are preferredalthough mixtures of solid and liquid epoxy resins may be employed.

Amine terminated polymers useful for preparing epoxy-based prepolymersinclude, for example, one or more of:

Amine terminated polyethers such as linear amine-terminatedpolyoxyethylene ethers having the formula:H₂N—(CH₂)₂—[O—(CH₂)₂—O—(CH₂)₂]_(n)—NH₂in which n preferably is 17 to 27.

Amine terminated polyethers such as linear amine-terminatedpolyoxypropylene ethers having the formula:

in which n preferably is 5 to 100. They are obtainable from HuntsmanChemical under the trade name JEFFAMINE® (D-series). The number averagemolecular weight of such amine-terminated polyoxypropylene ethers mayvary, for example, from about 200 to about 2000.

Amine terminated polyethers such as trifunctional compounds having theformula:

in which A is:

and x, y and z independently of each other are 1 to 40 and x+y+z ispreferably >6. Representative examples of these trifunctional compoundsare available commercially from Huntsman Chemical under the tradenameJEFFAMINE® (T-series). Such substances typically have number averagemolecular weights of from about 400 to about 5000.

Amino silane capped polymers, such as those that may be embraced by thegeneral formula:

where R¹, R², R³ and R⁴ may be the same or different and are selectedfrom hydrogen, hydroxyl, alkyl, alkoxy, alkenyl, alkenyloxy, aryl, andaryloxy; R⁵ and R⁶ may be the same or different and are selected fromhydrogen, alkyl and aryl; and X is selected from alkylene, alkenylene,arylene, with or without interruption by a heteroatom; polyurethanes;polyethers; polyesters; polyacrylates; polyamides; polydienes;polysiloxanes; and polyimides.

Amine-terminated siloxanes, such as diamino siloxanes embraced by theformula:

where R¹¹ and R¹² may be the same or different and are selected fromalkylene, arylene, alkylene oxide, arylene oxide, alkylene esters,arylene esters, alkylene amides or arylene amides; R⁹ and R¹⁰ may be thesame or different and are selected from alkyl or aryl; R⁷ and R⁸ are asdefined above and n is 1-1,200.

Certain amino-modified silicone fluids that are commercially availablefrom Shin-Etsu under the trade designations KF857, KF858, KF859, KF861,KF864 and KF880 may be useful. In addition, Wacker Silicones offerscommercially a line of amino-functional silicone fluids designated asL650, L651, L653, L654, L655 and L656, and an amino-functionalpolydimethylsiloxane under the tradename WACKER FINISH WR 1600 that maybe useful.

Other amino-functionalized silanes or siloxanes useful in forming theadduct include materials available from Degussa's Sivento division, suchas a proprietary aminofunctional silane composition (DYNASYLAN® 1126),an oligomeric diaminosilane system (DYNASYLAN® 1146),N-vinylbenzyl-N′-aminoethyl-e-aminopropylpolysiloxane (DYNASYLAN® 1175),N-(n-butyl)-3-aminopropyltrimethoxysilane (DYNASYLAN® 1189), aproprietary aminofunctional silane composition (DYNASYLAN® 1204),N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane (DYNASYLAN® 1411),3-aminopropylmthyldiethoxysilane (DYNASYLAN® 1505),3-aminopropylmethyldiethoxysilane (DYNASYLAN® 1506),3-aminopropyltriethoxysilane (DYNASYLAN® AMEO), a proprietaryaminosilane composition (DYNASYLAN® AMEO-T),3-aminopropyltrimethoxysilane (DYNASYLAN® AMMO),N-2-aminoethyl-3-aminopropyltrimethoxysilane (DYNASYLAN® DAMO),N-(2-aminoethyl)-3-aminopropyltrimethoxysilane (DYNASYLAN® DAMO-T) and atriamino-functional propyltrimethoxysilane (DYNASYLAN® TRIAMO).

Mixtures of amine-terminated polyethers may be used. Amine-terminatedpolyethers containing both oxyethylene and oxypropylene repeating unitsmay also be utilized as the amino-terminated polyether. Preferably, theamino-terminated polyether contains at least two amine groups permolecule. Preferably, the amine groups are primary amine groups. Theamino-terminated polyether is preferably aliphatic.

Generally speaking, the ratio of epoxide groups to amine groups in theadduct will be chosen based on use in the curable composition. An adducthaving an excess of epoxy groups over amino groups (i.e., theepoxy-based prepolymer contains essentially no free amine groups) isuseful for addition to an epoxy resin component. Typically, there is a1.5 to 10-fold excess, for example a 3.5-fold excess of epoxy groupsover the active hydrogen equivalents (AHEW) of the amine-terminatedpolyether. An excess of amino groups over epoxide groups (i.e., theepoxy-based prepolymer contains no free epoxide groups) is useful foraddition to a curing agent component. Typically, the epoxy-basedprepolymer is initially prepared in a first stage by reacting the epoxyresins with the amine-terminated polymer in the desired ratio and at anelevated temperature for a suitable time. The preparation of epoxy-basedprepolymers from amine-terminated polyethers is known in the art and isdescribed, for example, in U.S. Pat. Nos. 5,084,532 and 6,015,865, eachof which is incorporated herein by reference in its entirety.

Other tougheners or impact modifiers known in the epoxy adhesive art maybe useful in addition to, or as a substitute for, the aforementionedepoxy-based prepolymers. Generally speaking, such tougheners and impactmodifiers are characterized by having glass transition temperaturesbelow about 0° C., advantageously below about −30° C. and preferablybelow about −50° C. Examples of such tougheners and impact modifiersinclude, but are not limited to:

Reaction products of epoxy-reactive copolymers of conjugated dienes suchas butadiene (especially epoxy-reactive copolymers of butadiene withrelatively polar co-monomers such as (meth)acrylonitrile, (meth)acrylicacid, or alkyl acrylates, e.g., carboxyl-terminated butadiene-nitrilerubbers, such as the products available commercially from Noveon underthe trade name HYCAR) with epoxy resins (as described, for example, inU.S. Patent Application Publication No. US 2005/0070634 and U.S. Pat.Nos. 6,776,869 and 6,998,011, each of which is incorporated herein byreference in its entirety);

Adducts of anhydrides (e.g., unsaturated anhydrides such as maleicanhydride)and diene polymers (e.g., liquid 1,4-cis polybutadienes),typically having number average molecular weights between about 1000 andabout 5000, including for example, the adducts sold under the tradenamePOLYVEST by Degussa Corporation, as well as further reaction products ofsuch adducts with epoxy resins;

Polyesters, including, for example, amorphous, crystalline and/orsemi-crystalline polyesters, including saturated polyesters, prepared bycondensation of aliphatic and/or aromatic dicarboxylic acids (or thecorresponding alkyl esters or anhydrides with diols having a chainlength of C₂ to C₂₀, the polyesters being of medium molecular weight(e.g., about 1000 to about 20,000 number average molecular weight), suchas the polyesters sold under the tradename DYNACOLL by DegussaCorporation, and including polyesters functionalized with carboxylicacid and/or hydroxyl endgroups, as well as adducts of suchfunctionalized polyesters with epoxy resins;

Adducts of dimeric fatty acids with epoxy resins (including, forexample, the adducts sold under the tradename EPON 872 by ResolutionPerformance Products, the adducts sold under the tradename HYPDX DA323(formerly ERISYS EMDA 3-23) by CVC Specialty Chemicals, as well as thoseadducts described in U.S. Pat. No. 5,218,063, incorporated herein byreference in its entirety);

Adducts of hydroxyl-containing triglycerides (e.g., castor oil) withepoxy resins (including, for example, the adducts sold under thetradename HELOXY 505 by Resolution Performance Products);

Adducts of polysulfides with epoxy resins (including, for example, theadducts sold under the tradename THIOPLAST EPS 350 by Akzo Nobel;

Adducts of amine-terminated polydienes and diene copolymers with epoxyresins;

Polyether prepolymers capped with hydroxyarylcarboxylic orhydroxyaralkylcarboxylic acids, or a capped polyester, polythiaester orpolyamide containing polyether segments, as described, for example, inU.S. Pat. No. 5,202,390, incorporated herein by reference in itsentirety, in particular the tougheners of formula I described in detailat column 1, line 59, to column 2, line 16, of said patent;

Block copolymers, wherein at least one polymeric block of the copolymerhas a glass transition temperature below 20° C. (preferably below 0° C.or below −30° C. or below −50° C.) and at least one polymeric block ofthe copolymer has a glass transition temperature above 20° C.(preferably above 50° C. or above 70° C.), in particular blockcopolymers containing a polystyrene block, a 1,4-polybutadiene block(preferably having a glass transition temperature below about −60degrees C.) and a polymethylmethacrylate block (preferably, having ahighly, i.e., >80%, syndiotactic structure), such as the SBM copolymersmade by living polymerization methods using nitroxide initiator (such asthe methods described in U.S. Pat. Nos. 5,677,387, 5,686,534, and5,886,112, each of which is incorporated herein by reference in itsentirety, and sold under the tradename NANOSTRENGTH by Arkema and theblock copolymers described in U.S. Pat. No. 6,894,113, incorporatedherein by reference in its entirety;

Carboxyl-functionalized adducts of amino- or hydroxyl-terminatedpolymers and carboxylic anhydrides, as well as further reaction productsof such adducts with epoxy resins (such as those described in U.S. Pat.No. 6,884,854 and U.S. Patent Application Publication No. 2005/0215730,each of which is incorporated herein by reference in its entirety);

Epoxy-terminated polyethers, such as polymers of alkylene oxides likeethylene oxide, propylene oxide or mixtures thereof that have beenfunctionalized with epoxy groups, including by reacting the hydroxygroups of a polyalkylene glycol with epichlorohydrin;

Phenol-terminated and aminophenyl-terminated products produced byreacting a stoichiometric excess of a carboxylic anhydride ordianhydride with a diamine or polyamine and then further reacting theexcess carboxylic anhydride or carboxylic acid groups with at least onepolyphenol or aminophenol, as described, for example, in U.S. PatentApplication Publication No. 2004/0181013, incorporated herein byreference in its entirety.

Mixtures of different auxiliary impact modifiers/toughening agents maybe used. The auxiliary impact modifier/toughening agent may be presentin the epoxy composition in an amount in the range of about 1% to about50% by weight of the epoxy composition, advantageously about 5% to about40% by weight of the epoxy composition and desirably about 10% to about30% by weight of the epoxy composition. Cost and viscosity of theresulting composition part may dictate the upper limit. The auxiliaryimpact modifiers/toughening agents can be formulated into either or bothof the epoxy resin component or the curing agent component as desirable.

Diluent

The curable composition can comprise one or more diluents. The diluentmay be reactive or non-reactive. In the reactive sense, the diluentshould possess functionality appropriate to react with components in theepoxy composition. In the non-reactive sense the diluent does not reactwith components and may affect the flexibility of the cured reactionproducts and/or be used to improve the mixability of the epoxycomposition components. Examples of non-reactive diluents include EPODILLV5 available from Air Products.

Reactive diluents can be monofunctional or advantageously can bepolyfunctional. One reactive diluent is monofunctional epoxy resin. Themonofunctional epoxy resin should have an epoxy group with an alkylgroup, examples of which include C₆-C₂₈ alkyl glycidyl ethers, C₆-C₂₈alkyl diglycidyl ethers, C₆-C₂₈ fatty acid glycidyl esters and C₆-C₂₈alkylphenol glycidyl ethers. Another reactive diluent comprises amono-epoxide (e.g., monoglycidyl ethers of alkyl- andalkenyl-substituted phenols).

Additional reactive diluents include those having (meth)acrylate and/orvinyl ether functionality. In some embodiments that include a reactivediluent, the reactive diluent is a “hybrid” diluent because it includesat least one vinyl ether or 1-alkenyl ether group and at least one(meth)acrylate group. For instance, the reactive diluent may berepresented by the following formula (A):

where R¹ is selected from hydrogen; aliphatic C₁₋₆ alkyl; and C₁₋₆cycloalkyl; R² is selected from C₂₋₂₀ alkylene; C₂₋₂₀ hydrocarbondiradical; and polyalkylene oxide; and R³ is selected from hydrogen andmethyl.

The reactive diluent may have a molecular weight of less than about1500. Advantageously, the molecular weight is less than about 750, moredesirably less than about 500. The viscosity of the reactive diluent maybe less than about 5000 cps at 25° C., more desirably less than about2000 cps and even more desirably about 50-500 cps.

The epoxy composition disclosed herein may contain, for example, up toabout 15 weight percent total of diluent. The diluent can be formulatedinto either or both of the epoxy resin component or the curing agentcomponent as desirable.

Adhesion Promoter

The curable composition can comprise one or more products to helpimprove adhesion of reaction products of the cured epoxy composition toa substrate surface. Useful adhesion promoter materials include reactionproducts of epoxy resins and compounds containing chelating functionalgroups (herein called “chelate-modified epoxy resins”) and functionalsilanes.

Such reaction products include those substances commonly referred to as“chelate epoxies” or “chelating epoxy resins”. The chelating functionalgroups include those functional groups capable of forming chelate bondswith divalent or polyvalent metal atoms, either by themselves or incooperation with other functional groups positioned on the samemolecule. Suitable chelating functional groups include, for example,phosphorus-containing acid groups (e.g., —PO(OH)₂), carboxylic acidgroups (—CO₂H), sulfur-containing acid groups (e.g., —SO₃H), aminogroups, and hydroxyl groups (particularly hydroxyl groups adjacent toeach other on aromatic rings). The preparation of such reaction productsmay be carried out by methods known in the art such as, for example,those methods described in U.S. Pat. Nos. 4,702,962 and 4,340,716,European Patent No. EP 342 035 and Japanese Patent Document Nos. JP58-063758 and JP 58-069265, each of which is incorporated herein byreference in its entirety. Reaction products of epoxy resins andcompounds containing chelating functional groups are also available fromcommercial sources such as, for example, the ADEKA Resins EP-49-10N,EP-49-55C, EP-49-10, EP-49-20, EP-49-23, and EP-49-25 sold by AsahiDenka.

Other compounds having metal chelating properties may also be used tohelp enhance the adhesion of the cured adhesive to a substrate surface,including, for example, the adhesion promoters described in U.S. PatentApplication Publication No. U.S. 2005/0129955, incorporated herein byreference in its entirety. Also suitable for use as adhesion promotersare the acetoacetate-functionalized modifying resins sold by KingIndustries under the brand name K-FLEX XM-B301.

Some functional silanes include a reactive component that can bond orinteract with the composition, a silane component that can react withsubstrates and/or other silane modified materials and a hydrolysablecomponent. Some functional silanes having an epoxy reactive componentare sold by Momentive Performance Materials Inc. of Connecticut.

The epoxy composition disclosed herein may contain, for example, up toabout 6 weight percent of adhesion promoter. The adhesion promoter canbe formulated into either or both of the epoxy resin component or thecuring agent component as desirable.

Fillers

The curable composition can optionally comprise one or more types offillers, such as the various platy (flake like) fillers; various groundor precipitated chalks; quartz powder; silica powder; alumina; non-platyclays; dolomite; various fibers such as carbon fibers, glass fibers,microballons, polymeric fibers; fused silica; carbon black; metal oxidessuch as calcium oxide; metal dioxides such as titanium dioxide; metalcarbonates such as calcium magnesium carbonate; barite; andsilicate-like fillers of the aluminum magnesium calcium silicate type,for example wollastonite and chlorite. The filler can optionally besurface treated, for example, by reaction with a coupling agent such asa silane. Filler can be formulated into either or both of the epoxyresin component or the curing agent component as desirable.

Adding micron sized silica particles does not increase chemicalresistance of the curable composition. Surprisingly, adding nanometersized (typically about 1 to about 100 nanometers, for example about 20nanometers) silica particles does appear to improve chemical resistanceof the curable composition. One exemplary nanosilica material is NANOPDXF520 available from Nanoresins AG in Geesthacht, Germany. Nanopox F520is described as a masterbatch of bisphenol F based epoxy resin systemand 40% silica particles having diameter of about 20 nanometers.

Useful amounts of filler typically range from about 0% by weight toabout 60% by weight of the total composition. Advantageously, fillersare present in an amount from about 0% by weight to about 45% by weightof the total composition.

Thixotrope

Any suitable thixotrope can be included in the present inventivecompositions. Suitable thixotropic agents include, for example,Disparlon 6100, Disparlon 6200 (King Industries, Science Rd., Norwalk,Conn.), organo clay, fumed silica, inert and/or functional fillers,plastic fillers, and polyamide powder. Useful amounts of thixotropestypically range from about 0% by weight to about 30% by weight of thetotal composition. Desirably, a thixotrope is present in an amount fromabout 1% by weight to about 10% by weight of the total composition.

Adjuvants

The curable composition can optionally comprise other common adjuvants,such as flow auxiliaries, coupling agents (e.g., silanes), tackifiers,flame retardants, rheology control agents, inhibitors, corrosioninhibitors, antioxidants, stabilizers, thickeners, plasticizers,elastomers, thermoplastics, coloring agents, shelf-life extenders (forexample, zinc chloride), industrial microbiostats, surfactants orwetting agents (for example, Zonyl® FSO, which is sold by DuPont),polymerization inhibitors, and other well-known additives, andcombinations thereof to further modify physical and chemical propertiesof the epoxy composition and/or cured reaction products obtained fromthe epoxy composition.

Depending on desired properties the relative proportions of theindividual components may vary within comparatively wide limits. Theadjuvants can be formulated into either or both of the epoxy resincomponent or the curing agent component as desirable.

The composition comprising each component can be prepared separately bymixing together the constituents. In preparing the epoxy resin componentdry materials can be combined with liquid or liquefied materials usingconventional processes and equipment to form a viscous, fluid epoxyresin component. The fluid epoxy resin component can be packaged asconvenient for storage and later use. In preparing the curing agentcomponent, dry materials can be combined with the liquid or liquefiedmaterials using conventional processes and equipment to form a viscous,fluid curing agent component. The curing agent component can be packagedas convenient for storage and later use.

Methods of Use

The disclosed composition is suitable for use in potting and sealingopenings in electrical equipment for use in hazardous locations.

The epoxy resin component and curing agent component are storedseparately. The two parts can be homogeneously mixed to form the curablecomposition shortly before use. The mixed, curable composition cantypically be applied at about room temperature to the aperture or areato be sealed. The mixed composition can have a viscosity of about 8,000cps to about 30,000 cps.

Once the epoxy resin component and curing agent component are mixed thecuring process starts. It is not necessary to heat the mixed compositionor substrates to begin the curing process. Temperature control canoptionally be used to modify the time required for the mixed compositionto cure. The mixed epoxy composition can have a work life of about 20 toabout 60 minutes before the mixed composition reacts to a non-flowablebut not fully cured state.

In one embodiment the disclosed epoxy resin component and curing agentcomponent can each be components of a two part adhesive package. Eachcomponent can be chemically separated and packaged as convenient foruse. The epoxy resin component and curing agent component can typicallybe homogeneously mixed and dispensed onto a substrate. For example, eachcomponent can be contained in one chamber of a cartridge. The cartridgesare placed in a dual cartridge applicator so that actuation of theapplicator dispenses predefined volumes of the epoxy resin component andcuring agent component. The dispensed components are forced through amixing nozzle and the mixed composition is dispensed into an aperture orother area to be sealed. Automated application equipment for mixing anddispensing a two part curable composition is known. The use of a liquidor flowable resin component and a liquid or flowable curing agentcomponent is advantageous for mixing and dispensing and also allows thedispensed composition to flow into the aperture or area to be sealed andaround any wires or other projections in the area to be sealed.

The following examples are included for purposes of illustration so thatthe disclosure may be more readily understood and are in no way intendedto limit the scope of the disclosure unless otherwise specificallyindicated.

The following test methods are referred to in the EXAMPLES.

Chemical Resistance (UL 674)

Note that UL 674 refers to requirements for sealed equipment, includingrequirements for components such as sealants used in the equipment. UL1203 is an equivalent standard for sealants only.

The epoxy resin component and curing agent component are mixed and curedto form cylindrical specimens of cured sealant material 0.5 inches indiameter and 0.75 inches long having ends perpendicular to the sides ofthe cylinder. Each specimen is measured and weighted. Three specimensare tested for compression strength. The remaining specimens aresegregated into six specimen sets and each set is exposed for 7 days(168 hours) to saturated vapors of one of the following chemicals.

a. acetic acid, glacial

b. acetone

c. ammonium hydroxide, 20% by weight

d. ASTM reference fuel C

e. diethyl ether

f. ethyl acetate

g. ethylene dichloride

h. furfural

i. n-hexane

j. methyl ethyl ketone

k. methanol

l. 2-nitropropane

m. toluene

After 168 hours of exposure three specimens from each set are measured,weighed and observed for discoloration, swelling, shrinking, cracking,crazing, leaching or dissolving. The other three specimens in the setare individually placed between plates in a compression testing machineand subjected to increasing compressive loading at a crosshead speed of0.1 inch per minute. The load is applied perpendicular to the axis ofthe specimen cylinder and the compressive force required to crack orbreak each specimen is recorded.

Suitable materials for hazardous location use must retain at least 85%of their compressive strength after 168 hours of exposure to anychemical vapor in the panel and must not lose or gain more than 1% oftheir initial weight after 168 hours of exposure to any chemical vaporin the panel and must not discolor, swell, shrink, crack, craze, leachor dissolve after 168 hours of exposure to any chemical vapor in thepanel.

Viscosity

Viscosity of composition components and freshly mixed epoxy compositionis tested using a Brookfield Viscometer with a #14 rotor turning at 10revolutions per minute. Compositions and components are tested at roomtemperature.

EXAMPLE 1

A two part epoxy composition was made.

composition 1 amount material epoxy resin component 40-100% epoxynovolac resin produced by reacting phenol- formaldehyde novolac andepichlorohydrin¹ 0-60% difunctional epoxy resin produced by reactingbisphenol F and epichlorohydrin² 0-20% epoxy novolac resin produced byreacting phenolic novolac resin and epichlorohydrin³ curing agentcomponent 15-85%  aliphatic amine⁴ 10-60%  amine functional adduct ofethylene diamine (EDA) and liquid epoxy resin with low residual EDA.⁵¹D.E.N. 431 available from Dow Chemical Company. ²EPON Resin 863available from Hexion Specialty Chemicals. ³EPON Resin 154 availablefrom Hexion Specialty Chemicals. ⁴ANCAMINE 2422 available from AirProducts. ⁵ANCAMINE 2410 available from Air Products.

Each component is separately prepared by mixing the ingredients of thatcomponent to a homogeneous state. The epoxy resin component had aviscosity of about 20,000 cps. The curing agent component had aviscosity of about 10,000 cps.

The two components were homogeneously mixed at a ratio of 2 parts epoxyresin component to 1 part curing agent component by volume. The mixedtwo part epoxy composition had an initial viscosity of about 15,000 cps.The mixed two part epoxy composition had a work life of less than 30minutes; and was solid in less than 120 minutes at room temperature.

EXAMPLE 1

A two part epoxy composition having a shortened cure time can be made.

composition 1 amount material epoxy resin component 40-100% epoxynovolac resin produced by reacting phenol- formaldehyde novolac andepichlorohydrin¹ 0-60% difunctional epoxy resin produced by reactingbisphenol F and epichlorohydrin² 0-20% epoxy novolac resin produced byreacting phenolic novolac resin and epichlorohydrin³ curing agentcomponent 15-85%  aliphatic amine⁴ 10-60%  amine functional adduct ofethylene diamine (EDA) and liquid epoxy resin with low residual EDA.⁵0-60% cure accelerator⁶ 0-60% cure accelerator ⁷ ¹D.E.N. 431 availablefrom Dow Chemical Company. ²EPON Resin 863 available from HexionSpecialty Chemicals. ³EPON Resin 154 available from Hexion SpecialtyChemicals. ⁴ANCAMINE 2422 available from Air Products. ⁵ANCAMINE 2410available from Air Products. ⁶2-furanmethanol, cas number 98-00-0 ⁷benzyl alcohol, cas number 100-51-6

Each component can be separately prepared by mixing the ingredients ofthat component to a homogeneous state. The epoxy resin component had aviscosity of about 20,000 cps. The curing agent component had aviscosity of about 10,000 cps.

The two components were homogeneously mixed at a ratio of 2 parts epoxyresin component to 1 part curing agent component by volume. The mixedtwo part epoxy composition of EXAMPLE 1 (without cure accelerator) had awork life of more than 60 minutes. The mixed two part epoxy compositionof EXAMPLE 1 (with cure accelerator) had a work life of less than 30minutes.

In a screening test the cured composition retained at least 85% of itscompression strength after exposure to glacial acetic acid, acetone andethylene dichloride under the UL 674 test.

EXAMPLE 2

A two part epoxy composition was made by combining the following:

composition 2 amount material epoxy resin component 50-70% epoxy novolacresin produced by reacting phenol- formaldehyde novolac andepichlorohydrin¹ 30-50% difunctional epoxy resin produced by reactingbisphenol F and epichlorohydrin² 0.1-1%  Titanium dioxide powder³0.005-0.02    air release agent⁴ curing agent component 30-50% aliphaticamine⁵ 30-50% amine functional adduct of ethylene diamine (EDA) andliquid epoxy resin with low residual EDA⁶ 10-30% 2-furanmethanol⁷0.1-2.0% carbon black⁸ 0.005-0.02    air release agent⁴ ¹D.E.N. 431available from Dow Chemical ²EPON Resin 863 available from HexionSpecialty Chemicals ³R-900 available from E. I. DuPont de Nemours andCompany. ⁴PC-1244 available from Monsanto Co. ⁵ANCAMINE 2422 availablefrom Air Products. ⁶ANCAMINE 2410 available from Air Products. ⁷casnumber 98-00-0 ⁸MONARCH 700 available from Cabot Corp.

The ingredients of each component were separately combined and mixed toa homogeneous state. The curing agent component was degassed andnitrogen purged to lessen air entrapment. The epoxy resin component hada white appearance; a specific gravity of about 1.20; and a viscosity ofabout 20,000 cps. The curing agent component had a black appearance; aspecific gravity of about 1.20; and a viscosity of about 10,000 cps.

When mixed at 2 parts epoxy resin component to 1 part curing agentcomponent by volume the resulting mixture had a black appearance and aninitial viscosity of about 15,000 cps. The mixed two part epoxycomposition has a gel time of less than 30 minutes; will be solid inless than 120 minutes and will cure to full strength in 1 to 7 days atroom temperature.

The cured composition passed the exposure test except for glacial aceticacid (weight gain of 3.5%) and methanol (weight gain of 1.9%). The curedcomposition retained at least 85% of its compression strength afterexposure to all of the UL 674 test panel chemicals. The mixed anduncured epoxy composition had a maximum 150° C. exotherm temperaturewhen tested using Differential Scanning Calorimeter.

EXAMPLE 3

A two part epoxy composition was made by combining the following:

composition 3 amount material epoxy resin component 50-70% epoxy novolacresin produced by reacting phenol- formaldehyde novolac andepichlorohydrin¹ 30-50% difunctional epoxy resin produced by reactingbisphenol F and epichlorohydrin and adding nano size silica² 0.1-1% Titanium dioxide powder³ 0.005-0.02    air release agent⁴ curing agentcomponent 30-50% aliphatic amine⁵ 30-50% amine functional adduct ofethylene diamine (EDA) and liquid epoxy resin with low residual EDA⁶10-30% 2-furanmethanol⁷ 0.1-2.0% carbon black⁸ 0.005-0.02    air releaseagent⁴ ¹D.E.N. 431 available from Dow Chemical ²NANOPOX F520 availablefrom NanoResins AG, Geesthacht, Germany. ³R-900 available from E. I.DuPont de Nemours and Company. ⁴PC-1244 available from Monsanto Co.⁵ANCAMINE 2422 available from Air Products. ⁶ANCAMINE 2410 availablefrom Air Products. ⁷cas number 98-00-0 ⁸MONARCH 700 available from CabotCorp.

The ingredients of each component were separately combined and mixed toa homogeneous state. The curing agent component was degassed andnitrogen purged to lessen air entrapment. The epoxy resin component hada white appearance; a specific gravity of about 1.20; and a viscosity ofabout 20,000 cps. The curing agent component had a black appearance; aspecific gravity of about 1.20; and a viscosity of about 10,000 cps.

When mixed at 2 parts epoxy resin component to 1 part curing agentcomponent by volume the resulting mixture had a black appearance and aninitial viscosity of about 15,000 cps. The mixed two part epoxycomposition has a gel time of less than 30 minutes; will be solid inless than 120 minutes and will cure to full strength in 1 to 7 days atroom temperature.

The cured composition passed the exposure test except for glacial aceticacid (weight gain of 1.4%; length change of 1.4% and diameter change of1.6%) and methanol (weight gain of 1.9%). The cured composition retainedat least 85% of its compression strength after exposure to all of the UL674 test panel chemicals. The mixed and uncured epoxy composition had amaximum 150° C. exotherm temperature when tested using DifferentialScanning Calorimeter.

It is believed that cured reaction products of composition 3 can passall of the UL 674 chemical resistance tests if the amine functionaladduct of ethylene diamine (EDA) and liquid epoxy resin is replaced withan amine functional adduct of an amine and a bisphenol F resin.

As an alternative, UL 674 section 45.8 allows tests to determineresistance of the sealing compound to chemicals to be conducted on acomplete sample or subassembly representative of the construction to beapproved and incorporating the sealing compound as intended in the finalassembly but without cables or conductors. It is believed that anelectrical assembly incorporating sealing composition 3 can pass UL 674under this alternative.

EXAMPLE 4

Two part epoxy compositions A-V were made by combining materials shownin the following tables. The materials of each component were separatelycombined and mixed to a homogeneous state. The curing agent componentwas degassed and nitrogen purged to lessen air entrapment. The twocomponents were homogeneously mixed at a ratio of 2 parts epoxy resincomponent to 1 part curing agent component by volume.

comparative compositions A-E A B C D E material amount (wt %) epoxyresin component epoxy novolac resin produced by 65 65 58.5 58.5 51.6reacting phenol-formaldehyde novolac and epichlorohydrin¹ difunctionalepoxy resin produced 20 20 18 18 15.9 by reacting bisphenol F andepichlorohydrin² epoxy novolac resin produced by 14 14 12.6 12.6 11.1reacting phenolic novolac resin and epichlorohydrin³ low viscosityaliphatic triglycidyl 1 1 0.9 0.9 0.8 ether⁴ difunctional epoxy resinproduced 0 0 10 10 20.6 by reacting bisphenol A and epichlorohydrin⁵curing agent component aliphatic amine⁶ 9.3 9.5 7.9 8.0 6.3 aminefunctional adduct of ethylene 0 0 0 0 0 diamine (EDA) and liquid epoxyresin with low residual EDA⁷ modified amine⁸ 43.7 58.6 44.9 59.9 45.2modified aliphatic amine ⁹ 43.7 28.6 44.4 28.8 45.2 modified aliphaticamine¹⁰ 3.3 3.3 3.3 3.3 3.3 ¹D.E.N. 431 available from Dow ChemicalCompany. ²EPON Resin 863 available from Hexion Specialty Chemicals.³EPON Resin 154 available from Hexion Specialty Chemicals. ⁴HELOXY 48available from Hexion Specialty Chemicals. ⁵EPON Resin 828 availablefrom Hexion Specialty Chemicals. ⁶ANCAMINE 2422 available from AirProducts. ⁷ANCAMINE 2410 available from Air Products. ⁸ANCAMINE 2334available from Air Products. ⁹ ANCAMINE 2432 available from AirProducts. ¹⁰ANCAMINE 1608 available from Air Products.

comparative compositions F-J F G H I J material amount (wt %) epoxyresin component epoxy novolac resin produced by 51.6 65 65 58.5 58.5reacting phenol-formaldehyde novolac and epichlorohydrin¹ difunctionalepoxy resin produced 15.9 20 20 18 18 by reacting bisphenol F andepichlorohydrin² epoxy novolac resin produced by 11.1 14 14 12.6 12.6reacting phenolic novolac resin and epichlorohydrin³ low viscosityaliphatic triglycidyl 0.8 1 1 0.9 0.9 ether⁴ difunctional epoxy resinproduced 20.6 0 0 10 10 by reacting bisphenol A and epichlorohydrin⁵curing agent component aliphatic amine⁶ 6.5 7.4 7.6 5.9 6.2 aminefunctional adduct of ethylene 0 15 15 15 15 diamine (EDA) and liquidepoxy resin with low residual EDA⁷ modified amine ⁸ 60.7 37.2 50 37.9 51modified aliphatic amine ⁹ 29.5 37.2 24.1 37.9 24.5 modified aliphaticamine¹⁰ 3.3 3.3 3.3 3.3 3.3 ¹D.E.N. 431 available from Dow ChemicalCompany. ²EPON Resin 863 available from Hexion Specialty Chemicals.³EPON Resin 154 available from Hexion Specialty Chemicals. ⁴HELOXY 48available from Hexion Specialty Chemicals. ⁵EPON Resin 828 availablefrom Hexion Specialty Chemicals. ⁶ANCAMINE 2422 available from AirProducts. ⁷ANCAMINE 2410 available from Air Products. ⁸ ANCAMINE 2334available from Air Products. ⁹ ANCAMINE 2432 available from AirProducts. ¹⁰ANCAMINE 1608 available from Air Products.

comparative compositions H-O K L M N O material amount (wt %) epoxyresin component difunctional epoxy resin produced 100 100 100 100 100 byreacting bisphenol A and epichlorohydrin¹ curing agent componentaliphatic amine² 53.5 50.7 48 100 94.7 modified amine ³ 0 0 0 100 94.7TEPA ⁴ 0 1.7 3.5 0 0 2-furanmethanol⁵ 46.5 47.6 48.5 0 2.6 ¹EPON Resin828 available from Hexion Specialty Chemicals. ²ANCAMINE 2422 availablefrom Air Products. ³ ANCAMINE 2334 ⁴ tetraethylenepentamine - mixture offour TEPA ethyleneamines including: TEPA CAS #000112-57-2,N-(2-aminoethyl)-N′-{2-(2-aminoethyl)amino}ethyl}-1,2-ethanediamine;AETETA CAS #031295-46-2,4-(2-aminoethyl)-N-(2-aminoethyl)-N′-{2-{(2-aminoethyl)amino}ethyl}-1,2-ethanediamine;APEEDA CAS #031295-54-2,1-(2-aminoethyl)-4-[(2-aminoethyl)-amino]ethyl]-piperazine; PEDETA CAS#031295-49-5,1-[2-[[2-[(2-aminoethyl)amino]ethyl]-amino]ethyl]-piperazine ⁵cas number98-00-0

comparative compositions P-T P Q R S T material amount (wt %) epoxyresin component difunctional epoxy resin produced 100 100 100 100 100 byreacting bisphenol A and epichlorohydrin¹ curing agent componentaliphatic amine² 5.3 10.8 21.6 43 48 modified amine ³ 89.8 79.6 59.319.2 9.9 TEPA ⁴ 0 0 0 0 0 2-furanmethanol⁵ 4.9 9.6 19.1 37.8 42.1 ¹EPONResin 828 available from Hexion Specialty Chemicals. ²ANCAMINE 2422available from Air Products. ³ ANCAMINE 2334 ⁴ tetraethylenepentamine -mixture of four TEPA ethyleneamines including: TEPA CAS #000112-57-2,N-(2-aminoethyl)-N′-{2-(2-aminoethyl)amino}ethyl}-1,2-ethanediamine;AETETA CAS #031295-46-2,4-(2-aminoethyl)-N-(2-aminoethyl)-N′-{2-{(2-aminoethyl)amino}ethyl}-1,2-ethanediamine;APEEDA CAS #031295-54-2,1-(2-aminoethyl)-4-[(2-aminoethyl)-amino]ethyl]-piperazine; PEDETA CAS#031295-49-5,1-[2-[[2-[(2-aminoethyl)amino]ethyl]-amino]ethyl]-piperazine ⁵cas number98-00-0

comparative compositions U-V U V material amount (wt %) epoxy resincomponent difunctional epoxy resin produced 100 100 by reactingbisphenol A and epichlorohydrin¹ curing agent component aliphatic amine²21.6 42 modified amine ³ 54.5 16.3 TEPA ⁴ 1.7 1.7 2-furanmethanol⁵ 22.240 ¹EPON Resin 828 available from Hexion Specialty Chemicals. ²ANCAMINE2422 available from Air Products. ³ ANCAMINE 2334 ⁴tetraethylenepentamine - mixture of four TEPA ethyleneamines including:TEPA CAS #000112-57-2,N-(2-aminoethyl)-N′-{2-(2-aminoethyl)amino}ethyl}-1,2-ethanediamine;AETETA CAS #031295-46-2,4-(2-aminoethyl)-N-(2-aminoethyl)-N′-{2-{(2-aminoethyl)amino}ethyl}-1,2-ethanediamine;APEEDA CAS #031295-54-2,1-(2-aminoethyl)-4-[(2-aminoethyl)-amino]ethyl]-piperazine; PEDETA CAS#031295-49-5,1-[2-[[2-[(2-aminoethyl)amino]ethyl]-amino]ethyl]-piperazine ⁵cas number98-00-0

UL 674 specifies weight changes of less than 1%. Compositions A throughJ had weight gains of 10.6% to 12.6% after exposure to glacial aceticacid vapors per UL 674. Compositions A through J had weight gains of4.1% to 6.7% after exposure to acetone vapors per UL 674. UL 674specifies a retained compression strength (crush force) of ≥85%.Compositions K through V had an unacceptable loss of compressionstrength after exposure to either acetone or glacial acetic acid vaporsper UL 674 as shown below.

K M Q T U V % retention after exposure 70.4 74.6 55.8 68.6 66 67.2 toglacial acetic acid vapor % retention after exposure 78.6 82.3 61.3 76.872.5 77.4 to acetone vapor

As seen from comparative compositions A-V almost all epoxy compositionswill not satisfy the requirements of UL 674 and will not be suited foruse in hazardous locations as they will not retain at least 85% of theircompressive strength after 168 hours of exposure to a chemical vapor inthe panel or they will lose or gain more than 1% of their initial weightafter 168 hours of exposure to a chemical vapor in the panel or theywill discolor, swell, shrink, crack, craze, leach or dissolve after 168hours of exposure to a chemical vapor in the panel. Compositions 1-3provide epoxy compositions that are believed to satisfy at least thealternative requirements of UL 674. Replacing the amine adduct incompositions 1-3 with an amine adduct of bisphenol F epoxy is believedto increase chemical resistance and allow cured reaction product samplesto pass the UL 674 requirements. These epoxy compositions are unusualand surprising in their ability to satisfy most or all of these ULrequirements.

While preferred embodiments have been set forth for purposes ofillustration, the foregoing description should not be deemed alimitation of the disclosure herein. Accordingly, various modifications,adaptations and alternatives may occur to one skilled in the art withoutdeparting from the spirit and scope of the present disclosure.

What is claimed:
 1. A two part, epoxy composition suitable for sealingequipment for use in Division 1 hazardous locations, consisting of anepoxy resin component and a curing agent component: the epoxy resincomponent consisting of an epoxy resin and optionally additives, whereinthe epoxy resin is selected from the group consisting of a novolac epoxyresin, a bisphenol F epoxy resin, a difunctional bisphenol F epoxy resinor a mixture thereof, and wherein the additives are selected from thegroup consisting of particulate impact modifier, auxiliary impactmodifier, auxiliary toughening agent, diluent, adhesion promoter,filler, thixotrope, air release agent, adjuvant, 2-furanmethanol, benzylalcohol, and combinations thereof, wherein the epoxy resin componentdoes not include bisphenol A epoxy resin; and a curing agent componentseparated from the epoxy resin component consisting of a curing agentand optionally additives, wherein the curing agent is selected from thegroup consisting of an aliphatic amine, an amine functional adduct ofethylene diamine and an epoxy resin, an amine functional adduct of anamine and a bisphenol F epoxy resin, an aliphatic amine and an aminefunctional adduct of ethylene diamine and an epoxy resin and a mixturethereof, and wherein the additives are selected from the groupconsisting of particulate impact modifier, auxiliary impact modifier,auxiliary toughening agent, diluent, adhesion promoter, filler,thixotrope, air release agent, adjuvant, 2-furanmethanol, benzylalcohol, and combinations thereof; wherein a mixture of the two part,epoxy composition is curable at room temperature and at least one of theepoxy resin component and the curing agent component includes2-furanmethanol.
 2. Cured reaction products of a mixture of the two partepoxy composition of claim
 1. 3. The two part, epoxy composition ofclaim 1 wherein the adjuvant is selected from flow auxiliary, couplingagent, tackifier, flame retardant, rheology control agent, inhibitor,antioxidant, stabilizer, thickener, plasticizer, elastomer,thermoplastic, coloring agent, shelf life extender, surfactant, wettingagent, polymerization inhibitor and combinations thereof.
 4. The twopart, epoxy composition of claim 1 wherein a mixture of the two part,epoxy composition has a viscosity of about 8,000 to about 30,000 cps. 5.The two part, epoxy composition of claim 1 wherein the epoxy resincomponent and the curing agent component do not include bisphenol Aepoxy resin.
 6. An electrical device, comprising: a housing defining anaperture providing a route between a housing exterior and a housinginterior volume; and a mixed two part, room temperature curable epoxycomposition sealing the aperture, wherein the epoxy composition consistsof an epoxy resin component and a curing agent component, the mixedepoxy composition having a viscosity of about 8,000 to about 30,000 cps;the epoxy resin component consisting of an epoxy resin and optionallyadditives, wherein the epoxy resin is selected from the group consistingof a novolac epoxy resin, a bisphenol F epoxy resin, a difunctionalbisphenol F epoxy resin and a mixture thereof; and wherein the additivesare selected from the group consisting of particulate impact modifier,auxiliary impact modifier, auxiliary toughening agent, diluent, adhesionpromoter, filler, thixotropes, air release agent, adjuvant,2-furanmethanol, benzyl alcohol, and combinations thereof; and thecuring agent component consisting of a curing agent and optionallyadditives, wherein the curing agent is selected from the groupconsisting of an aliphatic amine, an amine functional adduct of ethylenediamine and an epoxy resin, an amine functional adduct of an amine and abisphenol F epoxy resin, an aliphatic amine and an amine functionaladduct of ethylene diamine and an epoxy resin, and a mixture thereof;and wherein the additives are selected from the group consisting ofparticulate impact modifier, auxiliary impact modifier, auxiliarytoughening agent, diluent, adhesion promoter, filler, thixotrope, airrelease agent, adjuvant, 2-furanmethanol, benzyl alcohol, andcombinations thereof; wherein the electrical device is suitable for usein Division 1 hazardous locations.
 7. The electrical device of claim 6,comprising a wire disposed through the aperture and the mixed two part,epoxy composition.
 8. The electrical device of claim 6, wherein the twopart, epoxy composition is cured and the electrical device is compliantwith UL
 674. 9. A method of using an epoxy composition to seal anelectrical device, comprising providing an electrical device having ahousing enclosing an interior space and having an exterior surface, theexterior surface defining an aperture providing communication into andout of the interior space; providing the epoxy composition of claim 6;mixing the epoxy resin component and the curing agent component to forma mixed epoxy composition; disposing the mixed epoxy composition ofclaim 6 into the housing aperture; exposing the mixed epoxy compositionto conditions appropriate to cure the epoxy composition to form curedreaction products in the housing aperture; wherein the cured reactionproducts seal the housing interior space and the electrical device issuitable for use in Division 1 hazardous locations.
 10. The method ofclaim 9, comprising a wire disposed through the aperture and the curedreaction products.
 11. The method of claim 9, wherein the electricaldevice is compliant with UL
 674. 12. The electrical device of claim 6,wherein the epoxy composition mixture does not include a bisphenol Aepoxy resin.
 13. The electrical device of claim 6, wherein the epoxycomposition mixture is self leveling.
 14. The electrical device of claim6, selected from an electrical motor, an electrical generator, anelectrical panel, an electrical raceway and an electrical junction. 15.The two part, epoxy composition of claim 6 wherein at least one of theepoxy resin component or the curing agent component includes2-furanmethanol.